Malaysian Deep-Tech Startup nanoSkunkWorkX Raises US$2M to Qualify AI Chip Packaging Interface
Bookmark (0) Please login to bookmark Close The Tin Men Capital-led round will move nSWX’s graphene-copper interface toward semiconductor partner…
Tag: nanoSkunkWorkX
Malaysian deep-tech startup nanoSkunkWorkX raises US$2m to tackle AI chip packaging bottleneck
Startup raises funding to bring its heat-management technology closer to AI chip deployment Beyond AI chips, nSWX is exploring how advanced…